350 nm process

Semiconductor manufacturing processes with a 350 nm MOSFET technology node
Semiconductor
device
fabrication
MOSFET scaling
(process nodes)
  • 020 µm – 1968
  • 010 µm – 1971
  • 006 µm – 1974
  • 003 µm – 1977
  •  1.5 µm – 1981
  • 001 µm – 1984
  • 800 nm – 1987
  • 600 nm – 1990
  • 350 nm – 1993
  • 250 nm – 1996
  • 180 nm – 1999
  • 130 nm – 2001
  • 090 nm – 2003
  • 065 nm – 2005
  • 045 nm – 2007
  • 032 nm – 2009
  • 028 nm – 2010
  • 022 nm – 2012
  • 014 nm – 2014
  • 010 nm – 2016
  • 007 nm – 2018
  • 005 nm – 2020
  • 003 nm – 2022
Future
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The 350 nanometer process (350 nm process) is a level of semiconductor process technology that was reached in the 1995–1996 timeframe by leading semiconductor companies like Intel and IBM.

Examples

Products featuring 350 nm manufacturing process

References

  1. ^ RIVA 128 gains support as preferred Direct3D developer platform press release, Nvidia, accessed December 3, 2023.
  2. ^ "Propeller I semiconductor process technology? Is it 350nm or 180nm?". Parallax Forums. Archived from the original on 2012-07-10. Retrieved 2015-09-13.
  3. ^ Petryk, Dmytro; Dyka, Zoya (2018). "Optical Fault Injections: a Setup Comparison". S2CID 198917285. {{cite journal}}: Cite journal requires |journal= (help)
  4. ^ Guillen, Oscar; Gruber, Michael; De Santis, Fabrizio (2017). "Low-Cost Setup for Localized Semi-invasive Optical Fault Injection Attacks: How Low Can We Go?". Constructive Side-Channel Analysis and Secure Design. Lecture Notes in Computer Science. Vol. 10348. pp. 207–222. doi:10.1007/978-3-319-64647-3_13. ISBN 978-3-319-64646-6.
Preceded by
600 nm
CMOS manufacturing processes Succeeded by
250 nm
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